Theoretical and Natural Science

- The Open Access Proceedings Series for Conferences


Theoretical and Natural Science

Vol. 12, 17 November 2023


Open Access | Article

Circuit defect detection based on AI deep learning

Luozhi Wang * 1
1 University of Science and Technology of China

* Author to whom correspondence should be addressed.

Theoretical and Natural Science, Vol. 12, 147-152
Published 17 November 2023. © 2023 The Author(s). Published by EWA Publishing
This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Citation Luozhi Wang. Circuit defect detection based on AI deep learning. TNS (2023) Vol. 12: 147-152. DOI: 10.54254/2753-8818/12/20230455.

Abstract

In the milieu of promptly advancing technology and increasing demand for electronic devices, circuit defect detection has become crucial to warranting product quality. This study tackles the cons of traditional defect detection methods, proposing a mind-boggling approach based on AI deep learning. The study intends to establish and enhance deep learning algorithms for the exact and real-time detection of circuit defects. This research encompasses an in-depth review of existing literature on circuit defect detection and AI deep learning, underlining the existing gaps and pitfalls in the field. The study will primarily deploy convolutional neural networks (CNNs) and recurrent neural networks (RNNs) as the primary tools to process various data modalities. The results highlight that the proposed AI deep learning framework depicts grander performance, unlike in traditional manual inspection. The study sets precedence in AI applications in quality control as it contributes to improved manufacturing efficiency, reduced production costs, and delivery of utmost-quality electronic products to consumers.

Keywords

convolutional neural networks (CNNs), recurrent neural networks (RNNs), AI deep learning, circuit defect detection, product quality

References

1. Psarommatis, F., Sousa, J., Mendonça, J. P., & Kiritsis, D. (2021). Zero-defect manufacturing the approach for higher manufacturing sustainability in the era of industry 4.0: A position paper. International Journal of Production Research, 60(1), 73-91.

2. Eleftheriadis, R. J., & Myklebust, O. (2016). A quality pathway to digitalization in manufacturing thru zero defect manufacturing practices. Proceedings of the 6th International Workshop of Advanced Manufacturing and Automation.

3. Xin, H., Chen, Z., & Wang, B. (2021). PCB electronic component defect detection method based on improved YOLOv4 algorithm. Journal of Physics: Conference Series, 1827(1), 012167.

4. Niu, J., Li, H., Chen, X., & Qian, K. (2023). An improved YOLOv5 network for detection of printed circuit board defects. Journal of Sensors, 2023, 1-10.

5. Tang, J., Liu, S., Zhao, D., Tang, L., Zou, W., & Zheng, B. (2023). PCB-YOLO: An improved detection algorithm of PCB surface defects based on YOLOv5. Sustainability, 15(7), 5963.

6. Borthakur, M., Latne, A., & Kulkarni, P. (2015). A comparative study of automated PCB defect detection algorithms and to propose an optimal approach to improve the technique. International Journal of Computer Applications, 114(6), 27-33.

7. Suhasini A.,Sonal D. Kalro, Prathiksha B. G. , Meghashree B. S., Phaneendra H. D.(2015).PCB Defect Detection Using Image Subtraction Algorithm.International Journal of Computer Science Trends and Technology (IJCST) – Volume 3 Issue 3, May-June 2015

8. Bonello, D. K., Iano, Y., & Neto, U. B. (2018). A new based image subtraction algorithm for bare PCB defect detection. International Journal of Multimedia and Image Processing, 8(3), 438-442.

9. Chen, I., Hwang, R., & Huang, H. (2023). PCB defect detection based on deep learning algorithm. Processes, 11(3), 775.

10. Vafeiadis, T., Dimitriou, N., Ioannidis, D., Wotherspoon, T., Tinker, G., & Tzovaras, D. (2018). A framework for inspection of dies attachment on PCB utilizing machine learning techniques. Journal of Management Analytics, 5(2), 81-94.

11. Mat Jizat, J. A., P.P. Abdul Majeed, A., Ab. Nasir, A. F., Taha, Z., & Yuen, E. (2021). Evaluation of the machine learning classifier in wafer defects classification. ICT Express, 7(4), 535-539.

12. Han, T., Liu, C., Yang, W., & Jiang, D. (2020). Deep transfer network with joint distribution adaptation: A new intelligent fault diagnosis framework for industry application. ISA Transactions, 97, 269-281.

13. Chen, J., Fan, S., Yang, C., Zhou, C., Zhu, H., & Li, Y. (2022). Stacked maximal quality-driven autoencoder: Deep feature representation for soft analyzer and its application on industrial processes. Information Sciences, 596, 280-303.

14. Liu, Q., & Huang, C. (2019). A fault diagnosis method based on transfer Convolutional neural networks. IEEE Access, 7, 171423-171430.

15. He, Y., Song, K., Meng, Q., & Yan, Y. (2020). An end-to-end steel surface defect detection approach via fusing multiple hierarchical features. IEEE Transactions on Instrumentation and Measurement, 69(4), 1493-1504.

16. An, Z., Wu, F., Zhang, C., Ma, J., Sun, B., Tang, B., & Liu, Y. (2023). Deep learning-based composite fault diagnosis. IEEE Journal on Emerging and Selected Topics in Circuits and Systems, 13(2), 572-581.

17. Xie, T., Huang, X., & Choi, S. (2021). Multi-sensor data fusion for rotating machinery fault diagnosis using residual Convolutional neural network. Volume 2: 41st Computers and Information in Engineering Conference (CIE).

18. Zhou, L., Ling, X., Zhu, S., Sun, Z., & Yang, J. (2021). An self-supervised learning & self-attention based method for defects classification on PCB surface images. 2021 2nd International Conference on Electronics, Communications and Information Technology (CECIT).

19. Adibhatla, V. A., Shieh, J., Abbod, M. F., Chih, H., Hsu, C. C., & Cheng, J. (2018). Detecting defects in PCB using deep learning via convolution neural networks. 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

20. Althubiti, S. A., Alenezi, F., Shitharth, S., K., S., & Reddy, C. V. (2022). Circuit manufacturing defect detection using VGG16 Convolutional neural networks. Wireless Communications and Mobile Computing, 2022, 1-10.

21. Tulbure, A., Tulbure, A., & Dulf, E. (2022). A review on modern defect detection models using DCNNs – Deep convolutional neural networks. Journal of Advanced Research, 35, 33-48.

22. Gao, W., & Wai, R. (2020). A novel fault identification method for photovoltaic array via Convolutional neural network and residual gated recurrent unit. IEEE Access, 8, 159493-159510.

23. Bhattacharya, A., & Cloutier, S. G. (2022). End-to-end deep learning framework for printed circuit board manufacturing defect classification. Scientific Reports, 12(1).

24. Kim, J., Ko, J., Choi, H., & Kim, H. (2021). Printed circuit board defect detection using deep learning via a skip-connected Convolutional Autoencoder. Sensors, 21(15), 4968.

Data Availability

The datasets used and/or analyzed during the current study will be available from the authors upon reasonable request.

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Volume Title
Proceedings of the 2023 International Conference on Mathematical Physics and Computational Simulation
ISBN (Print)
978-1-83558-135-3
ISBN (Online)
978-1-83558-136-0
Published Date
17 November 2023
Series
Theoretical and Natural Science
ISSN (Print)
2753-8818
ISSN (Online)
2753-8826
DOI
10.54254/2753-8818/12/20230455
Copyright
17 November 2023
Open Access
This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited

Copyright © 2023 EWA Publishing. Unless Otherwise Stated